EEJA

EEJA is seeking and providing the best plating solution in surface finishing technology

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Products Lineup
Chemical proces
Plating type
  • Non-cyanide process
  • Electroless process
  • Electro Au process
  • Pt process
  • Pd process
  • Base-metal process
Application
  • For semiconductor parts
  • For Package
  • For Wafer
  • For Connector contacts
Plating equipment
  • Bump forming
  • WL-CSP process
  • Via filling
  • Electroless UBM process
  • Micro Patterning
  • Semiconductor devices
Topics
  • 2008.12
    SEMCON Japan (Chiba-Makuhari)
  • 2008.10
    TPCA 2008 (Taipei)
  • 2008.09
    SEMICON Taiwan (Taipei)
  • 2007.04-
    Incheon Laboratory iContract laboratoryj Open
  • 2007-
    Providing [UBM process solution and equipment] start

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